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Instrument Glasses

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Precision Micro Dicing Saw

Precision Micro Dicing Saw

Originally used for the microchip industry, we have adapted a microchip sawing machine to dice very thin plates of glass ranging from 0.01mm thickness to 3.0mm thickness, on a maximum plate size of 100mm square.

These can be diced, grooved or slotted to very high tolerances down to +0.005mm.

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  • Cutting
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  • Precision Micro Dicing Saw
  • Silk Screen Printing
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  • Coating Photo Etching
  • Borosilicate Tubing Rod
  • Cleaning Inspection

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